RF Microwave&Analog Electronic Components

Hisiwell products include: RF microwave transistors,power amplifiers,switches, attenuators, phase shifters, mixers,VCO,diodes and capacitors, and are widely used in fields such as microwave communication, radar, electronic countermeasure,electronic measurement,navigation,aviation,space etc.

Microwave hybrid integrated circuits, broadband microsystems, integrated filtering, crystal oscillators, space synthesis, frequency sources, MMIC, GaN power modules, T/R modules, THz modules,etc.

NEDITEK offers qualified Microwave and Millimeter-wave products and solutions for a wide range of applications like automobile telematics and sensors,radio and wireless communication sets,satelite remote sensing and telemetry,and other civil fields.

Microwave hybrid integrated circuits, broadband microsystems, integrated filtering, crystal oscillators, space synthesis, frequency sources, MMIC, GaN power modules, T/R modules, THz modules,etc.

All kinds of microstrip series, sticker series, embedded series, coaxial series, waveguide series circulators & isolators and circulator components.

CEC Passive devices include：Balun&Transformer,Bridge,Coupler,Power splitter & Combiner.Complete replacement：MINI-Circuits,M/A-COM,IPP,Werlatone,Synergy.

Amplifiers, linear products, ADCs, DACs, high digital logic circuits, power management processors, RF microwaves, MEMS

Amplifiers, controllers, discrete transistor filters and duplexers, frequency converters and frequency sources

Main products: front-end modules, hybrid microcircuits, infrastructure subsystems, mixer demodulators, phase shifters, synthesizers, etc.

Aerospace/military grade:FPGA,CPU,PSOC,ASIC,FLASH,NOR FLASH,NAND FLASH,EEPROM.replacing XILINX,INTEL,ATMEL,AMD,3D-PLUS,SAMSUNG,AEROFLEX.

BMTI products include: aerospace grade/military grade MPUSoC, FPGA, A/D&D/A Convent & IC, memory IC,bus and interface IC, general logic chip, radio frequency and microwave IC, power management IC , ASIC, discrete devices, etc. Such products re used in aviation, electronics, ship-manufacturing, weapon-manufacturing, nuclear industries and other fields.

Operational amplifiers, comparators, low dropout linear regulators, voltage regulators,logic circuits, optocouplers, drivers, CMOS image sensors, A/D&D/A conventers, CPU, DSP, bus circuits, memories, radiation hardened VDMOS (Replacing IR JANS series), general-purpose DC/DC, motor drivers , isolation amplifiers(replacing ADI), DC/AC power converters, interface circuits ​

A/D&D/A conventers,powers and power management IC, power drivers and interface circuits, analog signal processing IC, RF IC

Bus interface circuits, clock drivers, power ICs, optocouplers, digital isolators, memories, single and dual gate logic circuits (54 series, CD4000 series), operational amplifiers, voltage comparators, A/D&D/A converters, diodes,etc

XILINX is the world's leading supplier of programmable logic complete solutions.

The industry's most advanced FPGA, CPLD and structured ASIC technology solution provider.

Chinese brand digital chip replacement (such as ADC,DAC). If necessary, please contact our company sales.

DC-DC power modules, high voltage output DC-DC power modules, low ripple output DC-DC power modules, linear regulators, switching regulators, power filters, pre-regulator modules, hold modules, linear amplifiers , switching amplifiers and brushless motor drivers

DC-DC power converters; power factor correction (PFC) module; AC-DC power converters;DC filters;surge suppressor; parallel current sharing module;multiple output & custom design converters; military VPX power supply

Multilayer resistors, multilayer capacitors, single-layer chip capacitors, inductors

HISIWELL RF Microwave diodes include die, plastic package, ceramic package, metal package, they can replace M/ACOM,Skyworks similar products

RF Power Module Packages, RF Power Transistor Package, Flat DC-DC Power Package, QFN Package, QFP Package, DIP Package , SMD Package

CEC offers unpressed sintered silver paste, pressed sintered silver paste, sintered silver film, Au80Sn20 gold tin preform strip, solder sheet, gold tin ball & Gold Tin paste. It is widely used in the packaging of power semiconductor devices and components such as high power diode, IGBT, SiC MOSFET and AMB substrate